Page 28 - HSP Annual Report 2022

3Construct New Plant Buildings to Expand Capacity
1st Software Building under the Hsinchu Park’s X Project
The HSP is rightfully the most important microchip industry cluster in the world. To accommodate rapidly changing times and ongoing advances in smart city, big data, AI, IoT, and cloud computing technologies, the HSPB has launched the X Project with a view to “developing software to sustain hardware” and “integrating software and hardware.” In turn, it promises to facilitate the transformation and upgrade of HSP companies. Of the three software buildings planned for this project, the first will be a steel structure with 12 stories above the ground and two underground. Construction on this NT$5 billion building kicked off on February 10, 2022. Upon completion in May 2024, it will provide 49 standard plant units (11 units measuring 99-231 square meters each; 11 units measuring 330- 495 square meters; 11 units measuring 660-990 square meters; and 16 units measuring 1,320-1,650 square meters.
Phase II Standard Plant Building in the Yilan Park
With a total cost of NT$370 million, construction on this steel and concrete structure of one underground level and five above started in October 2019. Its completion at the end of 2021 was followed first by inspection and acceptance and then official inauguration in April 2022. It offers 32 plant units: 10 units measuring 82.5 square meters each, 13 units measuring 165 square meters, seven units measuring 330 square meters, and two units measuring 660 square meters. Tenant companies are thus given an extra option other than renting land to build their own plants. Hopefully this project will help attract more tenant companies to foster the cluster effect, thereby driving industry upgrade and economic development as well as creating jobs in eastern Taiwan.
▲ Simulation of the X Project
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Hsinchu Science Park Annual Report 2022