Page 26 - 2019 Annual Report Hsinchu Science Park

24 Hsinchu Science Park 2019Annual Report Major Investment Projects
1. Taiwan Semiconductor Manufacturing Co., Ltd.’s expansion in the HSP
To prepare for introduction of advanced process technology early on, TSMC plans to set up an R&D center at Baoshan to develop 3nm process technology. With an investment of up to US$5.842 billion, the center is expected to create 2,300 jobs.
2. Qualcomm Technologies, Inc.’s establishment of R&D centers in the HSP
The American firm plans to set up its Operations, Manufacturing Engineering, and Testing Center, Multimedia R&D Center, and Mobile AI Innovation Center in the HSP. Expected to hire more than 1,000 people, the three centers promise to speed up the development of Taiwan’s mobile communications industry.
3. Kinik Co.’s expansion in the Juhnan Park
Kinik plans to invest some US$97.36 million in building a 300mm reclaimed wafer fab in the Jhunan Park to provide chipmakers and optoelectronics firms with reclaimed wafers of high reclaimability and a minimal damage layer. The new fab is expected to create some 180 jobs.
4. Mirle Automation Corp.’s expansion in the Tongluo Park
Mirle plans to build a new plant on a 2.6-hectare lot in the Tongluo Park to manufacture automated equipment for chip packaging and industrial control products. First-phase construction on the plant is scheduled to be completed at the end of 2020.
5. Excellence Optoelectronics Inc.’s expansion in the Jhunan Park
EOI plans to build a manufacturing and R&D center in the Jhunan Park. While focusing on automotive
LED lighting modules and ultra-bright, high-efficiency LED components, the center will also develop both mini LED displays meant for dashboards and large LED displays.
Yilan Park—a New Cluster of Smart Innovative Ventures
Since the establishment of a business solicitation task force in May 2018, the Yilan Park has done admirably well on this front. To date it has paid visits to more than 160 potential investors. In 2019, the park ushered in 12 tenant companies, a 33% increase from a year earlier.
As phase 1 standard plants are about to be fully occupied soon, a groundbreaking ceremony was held for a phase 2 standard plant building on October 28, 2019. With five stories above the ground and one level underground, the building will have a total floor area of 13,172 square meters and make available 41 standard plants to tenant companies. Upon its completion set for 2021, it will prove a magnet to homecoming job seekers and thus give a boost to the local economy.
In the environmental impact statement presented for the Yilan Park, the HSPB indicated readiness to introduce telecommunications knowledge service, digital creativity, and R&D ventures. To better accommodate industrial development and integrate local characteristics, the HSPB now also welcomes biotechnology, precision machinery, communications, optoelectronics components and materials, and green energy ventures. In the days ahead, emphasis will also be placed on adapting to the government’s industrial innovation program and incorporating emerging technologies, thereby promoting the region’s industrial transformation and creating jobs for the local populace.
Groundbreaking for Qualcomm’s R&D Center in the HSP