Page 42 - 2019 Annual Report Hsinchu Science Park

40
Hsinchu Science Park 2019Annual Report
1R&D Sponsorship and Subsidies
R&D Projects
1. Project for Industry-Academia Collaboration on Innovative R&D in Science Parks
Launched in 2010, the Project for Industry- Academia Collaboration on Innovative R&D in Science Parks is designed to have tenant companies, academic institutions, and research entities join forces and consolidate their resources. In turn, they can work together toward heterogeneous integration and cross-sector applications and develop products and technologies with marketability. In 2019, approval was extended to 12 applications for a combined US$1.947 million in grants under the project. This outlay was expected to induce tenant companies to come up with over US$3.895 million of R&D spending on their own. In the meantime, the project solicited involvement by a total of 157 R&D engineers from tenant companies and provided training to another 53 professionals. Some previously subsidized projects saw their completion in 2019:
lOptimize TPU tubing for medical imaging to enhance medical care quality
Pacific Hospital Supply Co., Ltd. teamed up with Professor Huang Chun-chin at the Department of Mold and Die Engineering, National Kaohsiung University of Sciences and Technology to optimize TPU tubing for medical imaging. Meant for microsurgery, it is to be placed inside the human body for drug administration, tests, and nutrition delivery. Coated with contrast agents, the tubing allows medical care personnel to readily track its position in the body in a noninvasive manner. Safe and reliable, it goes a long way toward enhancing medical care efficiency.
lDevelop 300mm super-flat silicon wafers for 10nm and more advanced processes
Taisil Electronic Materials Corp. joined forces with Professor Chen Jyh-chen at the Department of Mechanical Engineering, National Central University to optimize epitaxy of super-flat wafers. Taisil thus emerged as Taiwan’s first supplier of 300mm super-flat wafers that already found their way into the 10nm process technology supply chain of leading semiconductor companies. On a par with
their international counterparts technologically, these super-flat wafers are set to help local companies compete more efficiently in terms of next-generation process technologies.
2. Program for Fostering Cross-Sector Integration to Promote Biomedicine
To help Taiwan move toward an innovation-driven economy, the government adopts biotechnology as a convergence point for fostering cross- sector integration and assisting HSP companies in taking full advantage of existing technologies and applications to integrate tangible and intangible strengths. Besides industry-academia collaboration and cross-sector integration, the HSPB builds on the HSP’s industry clusters and division of specializations to encourage tenant
1. Pacific Hospital Supply Co., Ltd.: TPU tubing for medical imaging
2. Taisil Electronic Materials Corp.: Wafer polishing process mechanism
3. A corner of the HSP’s 2018 Innovative Medical Devices Exhibition
1
3
2